Ouster’s Post

The MEMS sensor market is worth $16.9B today. It is projected to hit $42.9B by 2034. Every smart device, autonomous vehicle, and industrial system relies on MEMS sensors. But building the next generation of MEMS sensors requires multi-material integration at the atomic scale: → Piezoelectric films for actuation → Conductive layers for signal readout → Protective coatings for harsh environments → All built on complex 3D structures Traditional fabrication tools weren’t built for this complexity. Each material needs its own process. Each new layer risks damaging what's beneath it. Our DALP® technology enables: - Selective additive and subtractive atomic layer processing - Multi-material stacks - Rapid prototyping of new sensor architectures - Localized functionalization MEMS is a massive market with room for breakthrough innovation. The winners will be those who can integrate materials in ways competitors can't. Who's developing next-gen sensors? Find out more on how we rapidly prototype electrochemical sensors, neuromorphic gas array sensors, temperature sensors, and more. 

Foxconn runs thermal simulations 150x faster now. Delta Electronics trains vision systems 100x quicker. Nvidia's manufacturing blueprint is already working. Quietly. While everyone debates AI's future, manufacturers are already transforming their operations. Nvidia calls it "physical AI" - connecting AI to the real world through cameras, sensors, and smart machines. The results speak for themselves: • TSMC converts 2D layouts to 3D facility models in seconds • BMW simulates entire factories years before construction • Delta Electronics hits 90% object detection accuracy This isn't about replacing workers. It's about filling the 50 million manufacturing jobs that can't be filled. The technology connects three key pieces: • Omniverse software for virtual training environments • Isaac robotics platform for skill development • Blackwell GPUs for extreme AI performance Major robotics companies like Boston Dynamics and Agility Robotics are already implementing these solutions. Uber plans to deploy 100,000 autonomous robotaxis by 2027 using this tech. The shift is happening now. Not in some distant future. Manufacturing's $50 trillion market is getting its AI moment. What changes are you seeing in your industry? #PhysicalAI #Manufacturing #Robotics 𝐒𝐨𝐮𝐫𝐜𝐞: https://lnkd.in/e-ARYMch

#Challenge of intelligent #chassis in China 1. Mass production implementation bottleneck 🔷 From the perspective of whole vehicle enterprises: The core #bottleneck is the lag in regulatory standards and vague definition of requirements. It is necessary to break through the regulatory adaptation of technologies such as #EMB and explore the real value needs of users. 🔷 From the perspective of component companies: Technological maturity can be addressed through iterative testing, and system level #security redundancy and cost control are key factors. After scaling up, costs can gradually decrease. 2. Integration path of intelligent driving and chassis 🔷 Establish an interactive mechanism for vehicle dynamics models: the chassis provides feedback on stable boundaries and road #friction information to intelligent driving, and intelligent driving optimizes trajectory planning. 🔷 Division of labor and collaboration: Intelligent driving is responsible for path decision-making, while the chassis is responsible for path following and failure protection, achieving "brain+cerebellum" humanized #control. 🔷 Cross domain empowerment: Intelligent driving #IMU signals improve the accuracy of chassis state estimation, and chassis friction and operating state data feed back into intelligent driving decisions. 3. AI driven and safety balance 🔷 Technical path: Train #AI large models based on physical models to avoid violating physical laws, and use MPC algorithms to ensure safety. 🔷 Verification system: Reliability is ensured through generative virtual simulation and massive road tests (1 billion level mileage), and a data cleaning and closed-loop #verification mechanism is established. (Sources by viewpoints of Panel Discussion at iCHASSIS 2025)

Advanced Packaging bottleneck will rule the next five years. Semiconductors have shifted from a quiet, cyclical sector to a strategic cornerstone—driven by AI’s compute boom, geopolitics, and supply‑chain concentration. Sovereignty programs (US/EU/JP/IN) and custom silicon from hyperscalers have accelerated demand. The next wave—edge AI, electrification (SiC/GaN), and high‑bandwidth systems—puts advanced packaging at the center. Performance now depends on chiplets, 2.5D/3D stacking, HBM, and CPO—and capacity is the new choke point. Where we fit: we partner with design houses to complete bids and deliver turnkey packaging, qualification, and production—so you focus on silicon while we take it to reliable, qualified volume. What we provide (one stop): - Substrate and package co‑design - SI/PI modeling and closure - Thermal simulation and cooling strategy - Assembly process and NPI - Test plan and hardware development - Qualification: AEC‑Q100 + space/high‑rel - Reliability/environmental testing - Volume production and supply chain If you’re building custom ASICs/chiplets for LiDAR, automotive, or space and need a packaging/production partner, DM me to connect. #AdvancedPackaging #Chiplets #3DIC #HBM #CPO #Semiconductors #Automotive #LiDAR #Space #AECQ100 #Reliability #SiPI #Thermal

Collins Aerospace unveils new manufacturing site in Bengaluru The facility will be equipped with advanced manufacturing tech such as AI, additive manufacturing and robotics, and will initially be used to manufacture seats, lighting and cargo systems, temperature sensors, communication and navigation systems, water solutions, and evacuation slides. Read more: https://lnkd.in/grQyr6_T

This visually striking video sparked a simple but powerful pattern: Focus. Explore. Re-focus. At the center of the frame is a circle—could be a wafer inside a tool chamber, a steering wheel guiding a car, or even our planet—symbolizing the critical focus in life and technology. From here, we explore outward every possibility, and re-focus to deliver a best solution. This iterative rhythm is similar to Design Thinking—a concept evolved over decades into sophisticated strategies for many fields. Yet in essence, innovation flourishes by cycling between divergence (exploring options) and convergence (re-focusing on priorities) around a well-defined problem (focusing). It's human-centered, and big impacts come from collaboration across diverse teams. We deliver material innovation that changes the world. Material innovation reshapes industries and lives through innovative materials science and engineering solutions. Our technology has made advancements in AI possible by making processors faster, more efficient and capable of even more complex tasks such as enabling development of autonomous driving, advanced sensors, next-generation displays and so much more. #MakeItMaterial

If AI is the brain, the hardware and mechanical systems are the body — and only when both move together can we achieve true innovation. From digital twins that mirror real machines in real-time, to intelligent factories that self-optimize using sensors and algorithms — the future of design is a powerful mix of mechanical precision and digital intelligence. Whether it’s designing a turbine blade, a robotic arm, or a cutting tool, engineers today are crafting systems that learn, adapt, and evolve. The best engineers of tomorrow will not just design parts — they’ll engineer intelligence. #EngineeringDesign #Innovation #AIinManufacturing #SmartEngineering #DigitalTransformation #MechanicalEngineers #FutureOfTech #ResearchAndDevelopment #Industry

Seeing beyond the visible spectrum just got easier. onsemi’s new CQD-based SWIR sensors extend spectral response from 400–2100 nm, delivering high resolution and scalability — all on standard silicon wafers. No more costly InGaAs. This breakthrough makes SWIR imaging affordable for applications like industrial automation, food inspection, aerospace, and autonomous navigation. A new era https://lnkd.in/gjw59CyK

The semiconductor industry is experiencing a significant shift, with advanced packaging playing a pivotal role in the next five years. Influenced by factors like the growth of AI, geopolitical changes, and supply chain emphasis, semiconductors have become strategically important. The increasing demand, driven by sovereignty initiatives and personalized silicon solutions, is now transitioning towards edge AI, electrification, and high-bandwidth systems, highlighting the crucial role of advanced packaging in optimizing performance. At our core, we partner with design firms to simplify processes, ensuring smooth bids, packaging solutions, and production capabilities. By relying on us for packaging complexities such as chiplets, 2.5D/3D stacking, HBM, and CPO technologies, you can focus on silicon innovation while we deliver dependable, scalable results. Our services include: - Collaborative substrate and package design - Thorough SI/PI modeling and validation - Efficient thermal management strategies - Streamlined assembly processes and NPI support - Customized test plans and hardware development - Adherence to AEC-Q100 standards and high-reliability applications - Comprehensive reliability and environmental testing - End-to-end volume production and supply chain management If you are exploring custom ASICs/chiplets development for AI/HPC, medical equipment, LiDAR, automotive, or space applications and are in need of a skilled packaging design, simulation and production partner, feel free to connect with us for further discussions. #AdvancedPackaging #Chiplets #3DIC #HBM #CPO #Semiconductors #Automotive #LiDAR #Space #AECQ100 #Reliability #SiPI #Thermal

Volkswagen Group is collaborating with Horizon Robotics to develop a new chip for smart cars in China. The chip will process data from cameras and sensors, with a computing power of 500 to 700 tera operations per second. Volkswagen aims to regain market share in China by enhancing its technology offerings and has also partnered with XPENG for electronics architecture development. The chip will be manufactured using a 3-4 nanometre processing node and is expected to be deployed in Volkswagen's third generation of China Electrical Architecture. Read more: https://lnkd.in/eV6G3Rnd 📰 Subscribe to the weekly Silicon Brief Newsletter: https://lnkd.in/ejfzg92J #ai #artificialintelligence #ainews #aichips