How Advanced Packaging is Revolutionizing Semiconductors

Advanced Packaging bottleneck will rule the next five years. Semiconductors have shifted from a quiet, cyclical sector to a strategic cornerstone—driven by AI’s compute boom, geopolitics, and supply‑chain concentration. Sovereignty programs (US/EU/JP/IN) and custom silicon from hyperscalers have accelerated demand. The next wave—edge AI, electrification (SiC/GaN), and high‑bandwidth systems—puts advanced packaging at the center. Performance now depends on chiplets, 2.5D/3D stacking, HBM, and CPO—and capacity is the new choke point. Where we fit: we partner with design houses to complete bids and deliver turnkey packaging, qualification, and production—so you focus on silicon while we take it to reliable, qualified volume. What we provide (one stop): - Substrate and package co‑design - SI/PI modeling and closure - Thermal simulation and cooling strategy - Assembly process and NPI - Test plan and hardware development - Qualification: AEC‑Q100 + space/high‑rel - Reliability/environmental testing - Volume production and supply chain If you’re building custom ASICs/chiplets for LiDAR, automotive, or space and need a packaging/production partner, DM me to connect. #AdvancedPackaging #Chiplets #3DIC #HBM #CPO #Semiconductors #Automotive #LiDAR #Space #AECQ100 #Reliability #SiPI #Thermal

TTM Technologies advances next-gen electronics with its high-density HDI PCBs featuring laser-drilled microvias, fine lines, and advanced materials for superior performance and signal integrity. Read more: https://ow.ly/sMMV50XpawR #printedcircuit #news #industry #HDI #PCB #electronics #manufacturing #innovation

NVIDIA and Samsung Electronics are teaming up to build a new AI factory—powered by more than 50,000 NVIDIA GPUs and aimed at fundamentally reshaping semiconductor manufacturing into an AI-native process. The factory will embed AI across every stage—from computational lithography, digital twins of fabs, robotics and smart production—turning a chip plant into a living, learning infrastructure. Read more: https://lnkd.in/eP_BYQyG

https://lnkd.in/dxXPVQW2 The Siemens-NVIDIA partnership unveiled at GTC represents a pivotal moment in industrial digitalization. Their integrated tech stack combining Siemens Xcelerator with NVIDIA Omniverse promises to compress factory design cycles from weeks to hours through AI-driven simulation. The strategic implications extend beyond efficiency gains. By enabling manufacturers to simulate hundreds of factory layouts simultaneously, this technology addresses the fundamental challenge of capital allocation in an era of supply chain volatility. The ability to render photorealistic, physics-based digital twins creates unprecedented visibility into operational scenarios before physical deployment. What's particularly compelling is the chip-to-grid integration approach. Siemens' end-to-end infrastructure capability, from semiconductor manufacturing to building systems, positions this partnership to tackle the energy efficiency paradox of AI factories - facilities that consume massive power while optimizing energy usage. The real test will be adoption velocity among manufacturers already struggling with legacy system integration. Can this technology bridge the gap between digital ambition and operational reality? #Industria #Manifattura #Automazione #EconomiaIndustriale #SupplyChain

NVIDIA AI Aerial is NVIDIA’s acceleration and intelligence platform for 5G/6G RAN. It shifts L1/L2 baseband to GPUs and layers in AI, data platforms, and digital twins for simulation, optimization, and automated ops—boosting throughput, flexibility, and lowering TCO. Materials modeling: private 5G + edge GPUs for high-rate sensor/vision streaming and shop-floor digital twins. Automotive: wireless, reconfigurable lines for robots/torque tools, EOL/OTA flashing, and V2X test cells. Pharma: GMP-grade private 5G for cleanrooms, AI inspection/serialization, and secure lab-to-edge analytics.

✨ Photon Design updates PICWave simulator 🖥️ New Intuitive Interface:  A refreshed and improved Graphic User Interface (GUI) for a better look, feel, and easier use. 📝 Enhanced Collaboration: A new notes section allows engineers to track changes and add comments directly to their designs. 🔄 New Bend Simulation Tool: A dedicated tool for simulating and optimizing photonic bends, a common circuit component. 🔥 Advanced Physical Modeling: Accurately simulates complex effects in powerful lasers, including: Thermal rollover (for LiDAR applications) Carrier diffusion and current spreading "Hole burning" in devices like hybrid silicon lasers 🌈 Broad Wavelength Accuracy: Its Wide-Band Gain Fitting algorithm ensures precise performance results across a wide range of wavelengths. ⚡ Powerful Large-Scale Simulation: Excels at simulating the interaction of multiple components in very large circuits (even meters long), going beyond the limits of traditional simulation methods (FDTD/FEM). 🧩 Seamless Integration: Works seamlessly with the company's other specialized tools for active (e.g., HAROLD) and passive (e.g., FIMMPROP) components. 👉 Active components that are integrated include semiconductor optcal amplifiers (SOAs), laser diodes, hybrid silicon lasers, distributed feedback lasers (DFBs), tunable lasers and ring lasers. Additionally, rigorous models of gratings, common PIC components such as directional couplers, and optimised lossless bends can all be imported. This update boosts both performance (with new tools and models) and productivity (with a better interface and note-taking). #EDA software #PIC #HAROLD #FIMMPROP #SOA PRSsemicon Technologies (A PRSGroup company) Semicon Academy (A PRSGroup Company) Spec2Chips Semiconductor (A PRSGroup company)

🎥 Next-Generation MIPI Camera Emulation – NetVision SVO-06 The NetVision SVO-06 MIPI Generator is a camera emulation board that converts USB3.0 video signals into MIPI CSI-2 output — enabling seamless camera simulation for ECU and image processing system development. With the ability to replay recorded or CG video as if it were coming from an actual CMOS image sensor, engineers can test and validate systems even before camera hardware is available. ⚙️ Key Features • Supports MIPI CSI-2 up to 1.5 Gbps per lane • Compatible with 6 Gbps automotive serializers (FPD-Link III / GMSL / GVIF2) • USB3.0 input and flexible frame timing control • Optional multi-board composition for larger video output • Ideal for ADAS development, camera emulation, and machine learning model validation The SVO-06 accelerates system development not only for automotive vision and ADAS applications but also for machine learning, computer vision, and robotics research, where synthetic or recorded data can be streamed into ECUs and AI inference devices in real time. 🤝  Ask us for more details. 📞 : +1(847) 584-2610 ✉️ : sales@n-denkeiamericas.com #NetVision #Denkei #MIPI #ADAS #MachineLearning #ComputerVision #EmbeddedSystems #CameraEmulation #ImageProcessing #FPDLink #GMSL #JetsonNano #RaspberryPi #AutomotiveTesting

Samsung Electronics says it will deploy 50,000+ NVIDIA GPUs to run an AI "megafactory" across its fabs. That scale matters because it ties design, lithography, equipment telemetry, and robotics into a single, learning system. Samsung reports 20x faster computational lithography (OPC) with cuLitho vs. prior CPU flows (internal measurement, October 31, 2025). NVIDIA's January 2025 Omniverse Mega Factory and robotic digital-twin blueprints formalized the stack. Meanwhile, Synopsys shows 15x OPC speedups on H100 today, with up to 20x projected on Blackwell-evidence the gains aren't just marketing. On the floor, Samsung also points to Jetson Thor-class robotics to push perception and planning down to the cell.

Managing the escalating data volumes vital for AI applications necessitates enhanced chip performance. Achieved through miniaturization, utilizing new materials, and 3D stacking of semiconductors, it demands optimized processes and superior quality control. At GBS Metrology, we provide cutting-edge optical 3D sensors globally. With high-speed cameras and real-time data processing on graphics cards, our sensors deliver unparalleled performance. Stay tuned for the unveiling of our newest devices at Semicon. #interferometry; #surface; #metrology; #3dscanning; #roughness; #measurements; #qualitycontrol; #automation; #microgeometries; #microstructure; #nanostructures; #3dsensor; #optical; #profiler; #surfacetexture; #GBS; #smartWLI; #CSI; #WLI; #visionsystem; #machinevision; #3dmeasurement; #3dinspection; #automation; #sensor; #factoryautomation; #repeatability; #engineering

#30DayMapChallenge - analog. This immediately reminded me of Semiconductor vertical component Analog Devices so we will be profiling this vertical for today's theme. - components: 27 - top performer: Marvell Technology. - worst: Unibap Space Solutions AB - growth rate overall: 17% - companies underwater past decade: 4 - Analog Devices past decade: 16.71% There are an incredible number of semiconductor companies that make GNSS receiver chips or MEMs devices. According to Grok: "Inertial Navigation Systems (INS) or GNSS/INS hybrids: MEMS-based versions fuse these sensors with GPS for precise positioning, velocity, and attitude in applications like drones, vehicles, smartphones, or robotics. They provide relative positioning to complement absolute systems like GPS." Detail on Marvell: Marvell's first commercial geospatial product was the launch of an application processor with an integrated GPS chipset, which was available for sale in 2006.: https://lnkd.in/e5PMDWZy. They then sold the division making these chips to ASR Microelectronics in 2017. So rolled entire position into that. Detail on Analog Devices: First accelerometer released 1991, remained heavily involved in positioning semiconductor industry since: https://lnkd.in/eyAjX2bj