ASML’s Post

I recently came across this post from ASML explaining why numerical aperture is such an important factor in wafer fabrication technology. As a student learning about semiconductor processes, I found it fascinating how even subtle optical parameters can significantly influence resolution and pattern accuracy during lithography. Posts like this remind me how complex and precise chip manufacturing really is — and how innovation in every small aspect contributes to advancing technology as a whole. Definitely worth a read for anyone interested in semiconductor engineering or nanotechnology!

Hello folks, We had an extremely educational session yesterday on "IC Design from concept to Silicon" by Hareesh Janakiraman sir. Deep insights into the technical and business aspects of chip design were given during the session. These included the steps from concept to production, the cost and effort involved, and how and why new chips are developed. Additionally, we looked at timing closure, DRC (Design Rule Check), pre-silicon validation, and the distinctions between hard and soft macros. We also learnt about ASML, the Dutch company that invented EUV (Extreme Ultraviolet) lithography machines, which are essential to the production of semiconductors today, and the session provided insight into contemporary chip fabrication challenges. Thank you to Hareesh Janakiraman sir for having such insightful and engaging sessions.

Optics is a critical part of every lithography process and system. At ASML, the engineers' mastery of optics is critical to ensuring precise chip patterning. When it comes to our lithography systems, chipmakers have a lot of knobs they can turn to ensure precise chip patterning. One of those knobs? Depth of focus. The following article gives a small insight to what depth of focus means and how it plays such a critical role into our cutting-edge technology. 🙂 #asml #lithography #chipmaking #semiconductors

Ever wondered how the structures on a photomask stay perfectly aligned across dozens of layers during the microchip manufacturing process? That’s where registration metrology comes in! ZEISS PROVE measures image placement with sub-nanometer accuracy, making perfect alignment across all masks possible – a key enabler for advanced technologies like EUV lithography. ⚡ Want to see how precision at this scale works in practice? 👇   #sms #facts #lithography

Do you know about one of the key drivers of performance in modern microchips? 📱 The photomask is at the heart of lithography and essential for cost-effective and sustainable microchip production. 💙 With the mask qualification tool AIMS® EUV 3.0, ZEISS Semiconductor Manufacturing Technology (SMT) has ushered in a new generation of mask qualification. The cutting-edge platform analyzes the mask repair success and triples mask throughput to support both Low-NA-EUV and High-NA-EUV lithography. With over 30 years of expertise in AIMS® mask qualification, ZEISS SMT remains committed to delivering solutions that create real value in everyday production. #ZEISS #Semiconductor #Innovation #EUV

That’s an amazing piece of technology that has been industrialized and finally is industry proven. Only very few companies worldwide are capable of developing, building and maintaining a production worthy EUV system in semiconductor industry.

TSMC rare video inside its Fab 21 near Phoenix, Arizona. The video shows hundreds of high-tech tools methodically crafting chips for various American companies. The crown jewels of the fab are of course ASML's Twinscan NXE extreme ultraviolet lithography tools that produce the most complex circuitry of such chips as Nvidia's Blackwell B300 processors" Wade Vinson Arizona Public Service - APS Service Toshiba Global Commerce Solutions Arizona Commerce Authority Mark Lewis https://lnkd.in/gyXS8ZzV

Electron blur can significantly affect the probability of a stochastic defect occurring in EUV lithography. It is possible to calculate the probability per pixel (here 1 nm x 1 nm), then the probability for a group of pixels constituting the defect. Look out for upcoming details in my Substack https://lnkd.in/d-AHZwSv.

Redefining Precision: Sub-Nanometer Motion Control in Vacuum As technology advances into the atomic and quantum scale, sub-nanometer motion control is no longer optional—it’s essential for applications like EUV lithography, quantum device assembly, and high-precision optical alignment. In collaboration with IMMS Institut für Mikroelektronik- und Mechatronik-Systeme gemeinnützige GmbH (IMMS GmbH), attocube systems integrated its IDS3010 laser interferometer (see https://lnkd.in/dTZuHiq5) into a closed-loop linear drive system operating in vacuum. To meet the stringent requirements for stability, a vacuum-compatible differential sensor head was developed. This design compensates for drifts in position and refractive index along the optical path, minimizing measurement noise and ensuring ultra-stable performance. The results speak for themselves: ✅ Sensor noise below 100 pm (1σ) at 10 kHz ✅ Repeatable positioning at 1 nm, 100 pm, and even 20 pm ✅ Reliable operation under demanding vacuum conditions This breakthrough confirms that the IDS3010 enables state-of-the-art closed-loop positioning for next-generation research and industrial applications. 🔍 Read the full TechNote and discover how attocube can help you achieve ultimate precision: https://lnkd.in/d9N76itr 📩 Contact us today at info@attocube.com to discuss integration for your application. #Nanotechnology #PrecisionEngineering #QuantumResearch #Innovation #MotionControl

AI-Driven Gray-Scale Lithography Defect Prediction via Hyperdimensional Feature Mapping & Bayesian Calibration This paper introduces a novel AI framework for predicting lithographic defect emergence using hyperdimensional feature mapping and Bayesian calibration, significantly improving yield and throughput in gray-scale lithography processes. By transforming complex image data into high-dimensional hypervectors and applying a Bayesian calibration process that dynamically adjusts for uncertainty, our system achieves a 15% reduction in defect rates compared to traditional statistical process control methods, with potential for market impact in advanced semiconductor manufacturing. 1. Introduction Gray-scale lithography is critical for advanced semiconductor fabrication, but defect prediction remains a significant challenge. Existing methods rely on statistical process control (SPC), which often fail to capture subtle, pre-defect patterns. This research introduces a paradigm shift, utilizing AI-driven defect prediction combining hyperdimensional feature mapping for efficient pattern recognition a https://lnkd.in/g-47vJ8E