Trends in Pcb Technology Innovations

Average competitors look up a few key parameters in one another’s product/technology roadmaps. Uncommon competitors run holistic studies in which portfolios, partnerships, papers, and #patents interweave. Take a look at this conceptual package diagram that is in a US #patent granted to TSMC: https://lnkd.in/gDw2DuWA Excerpts (edited): “The RDL structures are directly formed over the package structure or the carrier substrate which is then removed, and thus the bonding of the package structure to an additional circuit board and the formation of additional bumps (such as C4 bumps) between the additional circuit board and the package structure are not required. A PCB manufacturing technique called LDI is adopted to fabricate the bottom RDL structure, which is essentially a coreless RDL substrate with a larger linewidth than that of the in-between RDL structures, i.e., interposers. Thus, the strength of the bottom RDL structure is improved, and the cost/time for manufacturing it may be reduced. Furthermore, IPD and/or IVR dies may be disposed between conductive pillars and embedded in the encapsulant, thereby improving package integration. And the logic and the memory dies (e.g., 3D memory cube) may be integrated side by side to realize in-memory computing (IMC) with high efficiency, high bandwidth and low latency.” 🔍Observations: Once AI/HPC chip engineers realize that even HBM4/5 can’t suffice their customers, enters 3D SRAM. Also, if advanced PCB solutions such as LDI or SLP can indeed reliably strengthen #RDL structure rigidity, the necessity of implementing costly, large-size organic/cored substrates warrants a review. Diagram Legends: 116c1: Conductive Pillar (or Thermal Conduit) 116c2: Conductive Pillar 116d1: Encapsulant (may be different from 116d2) 116d2: Encapsulant (may be different from 116d1) 116g: Conductive Layer (or Thermal Pad) 124: (Fine-Pitch) Copper Pillar 126: Dielectric Layer made of polybenzoxazole (PBO) and/or polyimide (PI) 130: Encapsulant made of mold resin, polymer, and/or silicon oxide/nitride 142: RDL Interposer/Dielectric Layer made of PBO, PI, benzocyclobutene (BCB), and/or silicon oxide 160: Conductive Pillar 172/222: Conductive Pillar 174/224: Solder Pad/Bump 176/226: Underfill 190/192: RDL Interposer/Dielectric Layer made of PBO, PI, BCB, and/or silicon oxide 200/202: Coreless RDL Substrate/Dielectric Layer made of PBO, PI, BCB, and/or silicon oxide 208: Under-Ball-Metallurgy (UBM) Pattern 210: Ball Grid Array (BGA) Solder Ball 230: Solder Pad/Bump 232: Underfill Further reading: 🏷️New Patent Application (2025): https://lnkd.in/g5TnFUxW #C4: Controlled-Collapse-Chip-Connection #PCB: Printed Circuit Board #LDI: Laser Direct Imaging #IPD: Integrated Passive Device #IVR: Integrated Voltage Regulator #SLP: Substrate-Like PCB #HBM: High-Bandwidth Memory ➟To be continued. #Chiplet #Chiplets #SiP #SemiconductorIndustry #AI #HPC 🕹️Disclaimer: The views/opinions expressed in this post are my own.

The Future of PCB Design: Key Innovations for the Next Decade PCB (Printed Circuit Board) design is on the cusp of a technological revolution. Over the next decade, groundbreaking advancements will make PCBs more efficient, sustainable, and capable of supporting next-gen technology. Nano-scale PCBs will bring angstrom-level precision, enabling smaller, more powerful circuits ideal for medical tech and wearables. This miniaturization drives energy efficiency and device evolution. Embedded with sensors, processors, and AI, intelligent PCBs will self-monitor, detect faults, and predict failures, boosting reliability and reducing maintenance costs. Self-healing circuits can repair damage autonomously, while reconfigurable designs adapt to system needs, excelling in dynamic environments like aerospace and defense. Biodegradable/self-recycling PCBs address e-waste concerns by using materials that decompose or recycle easily, advancing sustainability in electronics. Massively parallelized 3D printing will revolutionize PCB manufacturing, speeding up production, enabling rapid prototyping, and reducing costs. Quantum computing requires specialized, ultra-precise PCBs to operate at cryogenic temperatures, unlocking unprecedented computing power. From nano-tech to quantum computing, the future of PCB design is about smarter, adaptable, and sustainable solutions, redefining electronics across industries. #PCBDesign #TechInnovation #Sustainability

High-Density Interconnect (#HDI) technology has transformed the electronics industry, enabling smaller, faster, and more powerful devices. One of the key innovations within HDI PCB design is the use of blind and buried vias, which enhance routing capabilities by freeing up additional routing resources, increasing the amount of routing channels while requiring fewer signal layers, and optimizing board space. This technology offers significant advantages in terms of routing density and electrical performance, but it comes with added complexity and cost. In this blog post, we explore what blind and buried vias are, their advantages, manufacturing processes, and their role in today’s complex #PCBdesign structures. https://sie.ag/395TF9