How semiconductor testing is evolving with Mike Slessor

xMEMS Labs Welcomes Chester Hwang as Chief Technology Officer * xMEMS Labs has appointed Chester Hwang as Chief Technology Officer, leveraging his expertise in high-voltage mixed-signal ASIC design. * Chester Hwang's experience will support the commercialization of xMEMS' Sycamore and Cypress MEMS speaker platforms based on innovative Sound from Ultrasound technology. * Sycamore MEMS loudspeakers provide lightweight, thin designs for conversational AI devices, while Cypress enables full-range noise-cancelling audio in earbuds. * µCooling air-pump-on-a-chip technology offers compact, efficient thermal management for consumer electronics, data centers, and computing systems. * xMEMS Labs, founded in 2018, holds over 250 patents, pioneering advancements in silicon-based audio and thermal solutions. * CEO Joseph Jiang highlights Dr. Hwang's leadership as pivotal for scaling and innovating MEMS-based driver technologies.

📣Advanced packaging is transforming edge AI, as highlighted in an EE Times article by Pax Wang of UMC, a Faraday Foundry partner.  By integrating 3D stacking, TSVs, and hybrid bonding with mature process nodes, the industry can deliver innovations at lower costs and with greater yield stability. 🎯An ecosystem consisting of Design and IP providers, foundries, and OSAT partners is making 3D-ICs widely available for edge AI developers and system architects. 𝗞𝗲𝘆 𝗲𝗻𝗮𝗯𝗹𝗲𝗿𝘀 𝗶𝗻𝗰𝗹𝘂𝗱𝗲: 📦 3D stacking → compact and efficient integration 🔌 TSVs → vertical connections between stacked dies for heterogeneous integration  ⚡ Hybrid bonding →direct wafer-to-wafer interconnects at fine pitches,  🧩 Interposers → dense integration of processors, memory, and accelerators 💲 Mature nodes → balancing costs and performance 🤝 Ecosystem →collaboration of design services/IP providers, foundries, OSATs 🔔 Learn more at https://lnkd.in/ge5MUX7M

I’m excited to share my recent interview featured in a Newsweek report, where we discussed the transformative trends that are poised to redefine the future of #electronics. From enabling next-generation #AI chips and breakthroughs in #semiconductor materials to the exciting possibilities of #quantum computing, neuromorphic architectures, and the convergence of biology and technology, we explored how innovation is redefining the industry. It was inspiring to share our vision for advancing digital living and to dive into the role we play in driving progress across these cutting-edge fields to create a smarter, more connected, and sustainable world.

Multi-Agent AI Is the Brain Behind Tomorrow’s Chips Chip design is becoming a closed-loop system—AI handles synthesis, verification, and fab scheduling with predictive precision. Read more: https://lnkd.in/gph3uW3G #SemiconductorRevolution #AIChipDesign #EDAInnovation #SmartSupplyChains #AIinManufacturing #NextGenChips #ChipDesignAutomation #AIForEngineers #FutureOfSemiconductors #AIProcurement #ResilientSupplyChains #MultiAgentSystems #VerificationAutomation #EDAWithAI #SiliconStrategy #AIAcceleratedDesign

The semiconductor industry is entering one of the most transformative decades in its history driven by process innovation, advanced packaging, and AI-enabled manufacturing. As devices become smaller, more powerful, and more interconnected, the way we design, package, and manufacture semiconductors is rapidly evolving. The shift toward 3D architectures, heterogeneous integration, and chiplet-based designs is creating new challenges and even greater opportunities. In my role as Director of Semiconductor Product Strategy, I’ve seen how AI and data-driven insights are reshaping what’s possible: Real-time process optimization powered by machine learning Smarter yield prediction and defect detection across complex nodes Advanced packaging workflows enhanced with automation and simulation Integrated product strategies that bridge design, manufacturing, and reliability The future of semiconductor manufacturing will not be defined by scaling alone, but by intelligence, integration, and innovation across the entire value chain. The companies that embrace AI-first manufacturing and advanced packaging will set the pace for the next generation of electronics. I’m excited for what’s ahead and I’d love to hear how your teams are leveraging AI or process innovation to drive transformation in semiconductor production.

Tune into the Daily Semiconductor Industry Podcast for 24th October 2025! Before we dive in, I want to give a huge shoutout to our sponsor, ADVACO. Their expertise in vacuum pump remanufacturing and service is unmatched, keeping the semiconductor industry running smoothly with precision and reliability. Thank you, ADVACO, for supporting this podcast and helping us bring valuable conversations to our listeners! Visit ADVACO at: https://lnkd.in/ge2dYwci Intel Corporation’s Q3 results beat Wall Street expectations, driving shares up 7%. Revenue rose to $13.7B, with AI demand fueling growth, though foundry losses widened to $2.3B. Despite strong government and NVIDIA investments, Intel faces challenges attracting external foundry clients, shifting focus to its 14A manufacturing process and AI-centric chips. Samsung Electronics introduced its sixth-gen HBM4 memory based on the 1c process at SEDEX 2025, aiming to regain market share in AI accelerators amid competition from SK hynix and Micron Technology. Zurich startup Chipmind raised $2.5M to develop AI agents that automate and optimize semiconductor design, accelerating chip development workflows. #ChipDesign,#SemiconductorManufacturing, #VLSI, #Lithography, #ICPackaging

Integrated Photonics: Enabling Scalable AI As AI advances, scaling it has become highly complex. It’s no longer just about adding compute power; it requires rethinking how resources are connected, from chiplets to global data centers. One of the key enablers of this transformation is Integrated Photonics, which allows faster, more energy-efficient data transfer using light. Integrated photonics merges optical components onto semiconductor chips, enabling high-speed, low-power data transmission, which is critical for modern AI infrastructure. At Keysight, integrated photonics is central to building smarter, faster, and more efficient data center networks. Our end-to-end PIC test solutions spread from design validation to production This video takes you on an in-depth journey into the story behind Keysight’s photonic solutions, offering a comprehensive overview: https://lnkd.in/dQmjFCDK

It was great to join PIC Summit Europe and experience the momentum and energy of the photonics ecosystem.   Thank you PhotonDelta for giving ASML the stage to provide a keynote on the developments shaping the semiconductor industry in addressing global demand for AI and data. The growing convergence of photonics and electronics drives the need for photonics – energy efficient, high bandwidth and low latency interconnects & applications. Addressing photonics patterning challenges requires a holistic lithography approach combining scanners, mask optimization, and metrology – to reduce overall optical losses through lower patterning uniformity and Line Edge Roughness. We are excited to continue collaboration across the eco system and play our part to mature and scale photonics technology and its production techniques.

News on intersection of tech and pharma—Eli Lilly and NVIDIA are joining forces to build what they’re calling the most powerful AI supercomputer in the pharmaceutical industry. 🔬 If you’ve followed the innovation curve in drug development, you know this is big. We’re talking more than 1,000 NVIDIA B300 GPUs driving an “AI factory” inside Lilly’s operations, and it’s all running on renewable energy. What really stands out to me is how this goes way beyond saving time in the lab. With their new system feeding the TuneLab platform, we’re looking at an ecosystem—from data crunching to AI-powered manufacturing—built for relentless learning and speed. Digital twins, accelerated imaging, faster cycles… the whole workflow gets pushed into overdrive. For me, it raises a real question about the future—will every pharma powerhouse soon need its own AI “factory” to keep up? Or does this set off a new kind of race, where innovation depends on compute, not just chemistry? 🤔 Would love to know, where do you see the first ripple effects landing?

Exploring the future of AI infrastructure at theCUBE’s Women in Leadership series. At theCUBE + Wired: Global Semiconductor Alliance Series, Manisha Gambhir, senior director, Mixed Signal Engineering at Marvell, joined leaders from NVIDIA, Microsoft, and Meta to discuss how AI is transforming semiconductor design and data center infrastructure. Manisha shared how Marvell is driving innovation across the ecosystem, from custom silicon for hyperscale compute to next-generation interconnects that power AI at every scale. She highlighted the growing diversity of interconnect technologies, from coherent lite to active electrical and optical cables, as AI acceleration reshapes system design. Watch the full conversation with John Furrier of theCUBE SiliconANGLE Media to hear insights on how AI, silicon, and infrastructure are converging to define the next era of data-driven computing: https://mrvl.co/4otd7rZ