Join FormFactor at SWTest Asia for our Tech Showcase! 📅 Thursday, November 20 | 13:35 Session: Enabling Next-Generation Devices: Trends, Challenges, and Solutions in Wafer-Level Probing for Advanced Packaging and Silicon Photonics Presenter: 👤 Cameron Harker – Sr. Director, Business Development As advanced packaging and silicon photonics continue to push the boundaries of next-generation semiconductor devices, wafer-level probing has never been more complex—or more essential. In this session, you’ll explore the latest trends shaping wafer-level probing, including heterogeneous integration, higher-density interconnects, and the increasing demand for precise optical and electrical measurements. Learn how FormFactor’s automation-ready probing systems and innovative technologies help customers: 🔹 Achieve nanometer-scale alignment 🔹 Maintain signal integrity across diverse device types 🔹 Scale test for high-volume manufacturing 🔹 Improve yield and reduce overall cost of test Don’t miss this opportunity to gain practical insights into how wafer-level probing is enabling the future of advanced packaging and silicon photonics. #FormFactor #SWTestAsia #AdvancedPackaging #SiliconPhotonics #WaferTest #SemiconductorTesting #Innovation
FormFactor to showcase wafer-level probing solutions at SWTest Asia
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VP at Delphon | SWTest General Chair | SWTest Asia General Chair
4dWe greatly appreciate the support of FormFactor Inc. at SWTest Asia. See you in Fukuoka.