Bourns Introduces CVH160808H Series for Power Conversion Solutions

🚀 #Nexperia: Powering Innovation Across Industries 🟩 As a leading basic semiconductor provider, Nexperia's components underpin innovation across key sectors. 🟦 In automotive, its #AEC-Qualified devices (including GaN FETs and SiC MOSFETs) ensure reliability for ADAS, in-vehicle systems, and EV power modules, withstanding extreme temperatures up to 175°C. For industrial needs, 1200V SiC MOSFETs and high-efficiency GaN solutions boost performance in solar inverters, 5G infrastructure, and factory automation, while hot-swap components support 24/7 server operations. 🟪 In consumer electronics, low-voltage #GaN FETs and ultra-low-power DC-DC converters enable compact designs and longer battery life for wearables, smartphones, and laptops. Shipping over 100 billion units annually, Nexperia's tech fuels efficiency and miniaturization worldwide.

💡 What Is CSP? CSP stands for Chip Scale Package, meaning the package is almost the same size as the die itself (typically within 20%). It’s compact, fast, and cost-efficient — the go-to choice for high-density and portable electronics. ⚙️ How It Works CSP minimizes the distance between the silicon die and the PCB. That means: • Lower parasitic inductance → faster signal transmission • Better thermal dissipation → improved reliability • Simpler assembly → direct surface mount, no complex interposers You’ll find ball grid array (BGA), flip-chip CSP, and wafer-level CSP (WLCSP) — each optimized for different device types. 🔬 Real-World Examples • #Apple A17 Pro (iPhone 15 Pro) → uses WLCSP for RF and power management ICs, enabling thinner designs and faster connections. • #Qualcomm #Snapdragon 8 Gen 3 → integrates flip-chip CSP for efficient mobile SoC packaging and lower latency. • #Tesla’s autopilot modules → rely on high-reliability CSPs for sensors and microcontrollers under extreme temperature ranges. • Wearables & IoT sensors → use WLCSP to shrink size and weight while boosting energy efficiency. 🚀 Why It Matters #CSP isn’t just smaller — it’s smarter. It drives the balance between miniaturization, performance, and manufacturability that defines today’s electronics. As we push into AI edge devices, 5G, and autonomous systems, CSP will continue to evolve — toward hybrid 3D stacks and fan-out integration. At ATPION , we’re exploring new CSP innovations within our Advanced Packaging line — enabling faster time-to-market and scalable production for next-gen devices. Because in the semiconductor world, the future gets smaller — and smarter. ⚡ #Semiconductors #AdvancedPackaging #CSP #WLCSP #FlipChip #AIChips #Electronics #Innovation #ATPION #TechLeadership #Microelectronics #5G #IoT #Miniaturization

Are Consumer ECGs Stuck in 2018? Seven years after the first wearable ECG hit the market, the biggest names in tech are still optimizing wellness, not diagnosis. Here’s how the leaders stack up in ECG-related patent portfolios: Samsung Electronics – 149 publications  Apple – 90 publications  Google – 62 publications  Withings – 21 publications  ŌURA – 19 publications  WHOOP – 9 publications  Garmin – 5 publications The numbers show where the investment is, but not where the innovation is going.  Despite hundreds of filings, all seven remain limited to single-lead ECGs that can screen for atrial fibrillation, but cannot detect ischemia, the signal of a heart attack. Billions of data points collected.  Zero is capable of a true diagnosis.  PatentVest analyzed global filings to reveal who’s advancing the state of cardiac technology, and who’s still circling the same lead.  Read full report: https://lnkd.in/eWayaAUV #CardiacDiagnostics #Wearables #MedTech #ECG #PatentVest 

 𝑻𝒉𝒆 𝑴𝒐𝒃𝒊𝒍𝒆 𝑪𝒂𝒎𝒆𝒓𝒂 𝑴𝒐𝒅𝒖𝒍𝒆 𝑴𝒂𝒓𝒌𝒆𝒕 𝑷𝒍𝒂𝒚𝒃𝒐𝒐𝒌: 𝑺𝒕𝒓𝒂𝒕𝒆𝒈𝒊𝒄 𝑭𝒓𝒂𝒎𝒆𝒘𝒐𝒓𝒌𝒔 𝒇𝒐𝒓 𝒂 $𝑿𝑿 𝑩𝒊𝒍𝒍𝒊𝒐𝒏 𝑴𝒂𝒓𝒌𝒆𝒕 The global mobile camera module market is experiencing robust growth, driven by increasing demand for higher‑resolution, multi‑camera systems in smartphones and other connected devices. According to one recent forecast, the camera module market is expected to grow from approximately USD 52.7 billion in 2025 to USD 141.8 billion by 2035, at a CAGR of around 10.4%. 🆅🅸🆂🅸🆃 🆄🆂:- https://lnkd.in/gy7xm8CU Key drivers fueling this market include rising consumer expectations for premium imaging features (such as periscope zoom, ultra‑wide, and depth sensing), the growth of 5G and content creation, and increasing adoption of advanced camera modules in automotive, wearable and IoT segments. Recent developments in the market show intensive innovation and strategic moves by leading players: for example, companies are launching ultra‑slim periscope zoom modules, integrating AI and 3D sensing into modules, and expanding into automotive camera solutions. 𝑻𝒐𝒑 𝑲𝒆𝒚 𝑷𝒍𝒂𝒚𝒆𝒓𝒔:  Dongguan SAMSUNG Electro-Mechanics Co., Ltd. | Sunny Optical Technology (Group) Co. Ltd.)  Ofilm Group Co.,Ltd. | Q Point Technology, Inc.| Cowell e Holdings Inc | Chicony Electronics Co., Ltd.  Primax Electronics Ltd. Inc |  Namuga | partron ESL  MCNEX| Sharp Electronics Corporation USA | Hon Hai PrecisionLUXVISIONS INNOVATION LIMITED STMicroelectronics N.V. | Toshiba  | KYOCERA AVX Components Corporation | ams OSRAM | OmniVision Optoelectronics Technologies (Shanghai) Co Ltd Inc | Intel Corporation | FUJIFILM Corporation | Himax Technologies, Inc. | Namuga | CammSys Corp.| Luxshare Precision Industry Co., Ltd. | Finisar Corporation | SEMI Taiwan| Beijing Huikang Boyuan Chemical Tech Co., Ltd. | VISION CONSULT MANAGEMENT & TECHNOLOGY V-COMTECH ANS #CameraModule #SmartphoneCamera #ImagingTechnology #ElectronicsComponents Top of Form Bottom of Form  

🎯 #Nexperia: Powering Innovation Across Industries ✔️ As a leading basic #semiconductor provider, Nexperia's #components underpin innovation across key sectors. 🕹️ In automotive, its #AEC-Qualified devices (including GaN FETs and SiC MOSFETs) ensure reliability for #ADAS, in-vehicle systems, and EV power modules, withstanding extreme temperatures up to 175°C. ⚙️ For industrial needs, 1200V SiC MOSFETs and high-efficiency GaN solutions boost performance in solar inverters, #5G infrastructure, and factory automation, while hot-swap components support 24/7 server operations. 💡 In consumer electronics, low-voltage GaN FETs and ultra-low-power DC-DC converters enable compact designs and longer battery life for wearables, smartphones, and laptops. 🏷️ Shipping over 100 billion units annually, Nexperia's tech fuels efficiency and miniaturization worldwide.

When FPC Meets Precision Molding: The Key to Durable & Miniaturized Electronics. Pushing the boundaries of what's possible in compact electronics requires moving beyond traditional assembly. That's where FPC Overmolding shines. By embedding flexible circuits directly into molded plastic, we achieve: ✅ Maximized Space Efficiency: 3D routing unlocks new design possibilities. ✅ Superior Reliability: A single, monolithic part that stands up to harsh environments. ✅ Streamlined Production: Fewer components and assembly steps reduce cost and complexity. This is the go-to technology for cutting-edge TWS earphones, wearables, and medical devices. The image below shows an overmolded FPC module we developed. Any guesses what it's for? #FPC #Overmolding #ElectronicsManufacturing #HardwareInnovation #Reliability

World’s first six-layer hybrid CMOS microchip — pushing the boundaries of ultra-thin and flexible electronics. Source: [ https://lnkd.in/gHQftPDt] On October 17, 2025, researchers at King Abdullah University of Science & Technology (KAUST) announced the development of the first six-stack hybrid CMOS (complementary metal-oxide-semiconductor) microchip. Their design integrates six vertically stacked layers—surpassing the previous two-layer record—and is tailored for large-area electronics like flexible displays and wearables. The fabrication process kept temperatures below 150 °C to protect underlying layers, addressing a key challenge in vertical stacking. This breakthrough opens the door for ultra-thin, efficient, and highly integrated electronics beyond the limits of traditional planar scaling, offering new paths for smart devices, large-area sensors, and the Internet of Things. #SixLayerChip #HybridCMOS #VerticalIntegration #FlexibleElectronics #MooresLawBeyond #ChipInnovation #SmartWearables #LargeAreaElectronics #SemiconductorBreakthrough #NextGenGadgets #ElectronicsMiniaturization #TechLeap #FutureOfChips #UltraThinTech #KAUSTInnovation

Lithium Manganese Button Cell Market: Powering Compact Electronics with Sustainability A lithium manganese button cell is a small, round battery that uses lithium and manganese dioxide to provide reliable, long-lasting power for compact electronic devices. Its stable voltage and extended shelf life make it ideal for wearables, medical devices, and remote controls. Key Market Drivers: Growing demand for portable, lightweight gadgets like wearables and medical devices Increasing miniaturization of electronic components Rising consumer preference for eco-friendly and recyclable batteries Key Market Restraints: Limited availability of raw materials such as lithium and manganese Environmental regulations increasing production costs Supply chain disruptions due to geopolitical factors Opportunities lie in developing advanced recycling technologies and greener manufacturing practices. Companies investing in sustainable solutions can gain a competitive edge, meet regulatory standards, and cater to eco-conscious consumers. Access a sample report here: https://lnkd.in/d-7KpZyG #BatteryTechnology #ElectronicsInnovation #SustainableEnergy #MedicalDevices #WearableTech

🌟 AI PCs and Beyond — How Connection Technology Is Powering the Next Wave of Smart Devices ⭕ Every January, CES sets the tone for where technology is heading — and in year of 2025, all eyes were on the rise of AI PCs. From Intel’s Core Ultra and AMD’s Ryzen AI to Qualcomm’s Snapdragon X Elite, global chipmakers are redefining what a “personal computer” means in the era of on-device intelligence. ‼️ Yet behind every leap in processing power lies a quieter revolution — the art of connection. As devices grow smarter, thinner, and faster, the way signals, power, and data flow between components becomes the true foundation of user experience. 👉 No doubt, it becomes extremely critical to design and engineer lightweight, high-reliability connector and test-interface solutions that empower innovation across PCs, smartphones, wearables, and the emerging world of AI robots. ✊ From high-frequency pogo-pin interfaces to modular floating connectors and thermal-optimized designs, the mission is simple — to help every device communicate flawlessly with the world around it. 🤝 As we are currently gearing up for upcoming CES 2026, I’m excited to continue sharing insights on how connector technology is quietly shaping the future of consumer electronics, AI computing, and robotics. 🤝 Let’s connect — and explore how smarter connections can create smarter worlds. #AIPC #CES2026 #ConsumerElectronics #ConnectorInnovation #Robotics Image source: CES 2025

We are proud to introduce the Grepow GRP1654 Series, our latest innovation in rechargeable steel-shell button cell batteries. Engineered for high-performance applications, this series provides a robust power solution for next-generation wearable and medical devices. The GRP1654RT model, at just 16mm in diameter and 5.4mm in thickness, delivers an impressive 10C high discharge rate, ensuring reliable power for high-drain electronics. Key Specifications: ▪️ Model: GRP1654 Series (e.g., GRP1654RT) ▪️ Type: Rechargeable Li-Ion Button Cell ▪️ Performance: 10C High Discharge Rate ▪️ Applications: Advanced Wearables, Medical Sensors, Compact Electronics Discover more specifications and how the GRP1654 series can power your next project: https://lnkd.in/gUQRT4gD #Grepow #ButtonCell #BatterySolution #WearablePower #MedicalBattery #RechargeableCoinCell #MicroBattery #BatteryTechnology #Engineering #ProductDesign